
A physical vapor deposition method where atoms are ejected from a target by plasma bombardment.Sputtering is a physical vapor deposition technique used to create thin films of material on a substrate. In a vacuum chamber, a plasma is generated near a target material, and the energetic ions from this plasma bombard the target, knocking out atoms through momentum transfer. These ejected atoms then travel and condense onto a substrate, forming a thin, uniform coating.
The phenomenon was first observed in 1852 by William Robert Grove, who noticed material being ejected from a cathode during electrical discharge experiments. It became a practical deposition technique in the mid-20th century.
A voltage is applied between the target (cathode) and the chamber, ionizing a process gas (typically argon) into a plasma. The positively charged argon ions are accelerated toward the negatively charged target. Upon impact, they collide with target atoms in a cascade, transferring enough energy to eject surface atoms. These sputtered atoms deposit onto the substrate, building up the film atom by atom. The process can be enhanced with magnetic fields (magnetron sputtering) to increase plasma density and deposition rate.
Widely used in semiconductor manufacturing to deposit metal interconnects, in optics for anti-reflective coatings, and in data storage for magnetic thin films.
Sputtering is the same process that slowly erodes the walls of fusion reactors, where plasma ions bombard the containment vessel — a major engineering challenge for future power plants.










